Awards

Intel Achievement Award 1999, Intel’s highest honor: Leadership of a Break-Thru Package Program.

Technology Manufacturing Group Excellence Award 1999: Flip Chip technology worldwide start-up.

Divisional Recognition Award 1995: Enabling Tape Carrier Package assembly capability in Taiwan.

Divisional Achievement Award 1993: Results driving cost conversion for PCMCIA assemblies.

Publications

IBM Technical Disclosure Bulletin, Vol.38 no.5 – Surface Mount Component Guard for TCP

Patents

5,779,134                       Method for surface mounting a heat sink to a printed circuit board

5,617,294                       Apparatus for removing heat from an IC package attached to a PCB

5,168,926                       Heat sink design integrating interface material

7,228,622-7,127,805       Electronic device carrier and manufacturing tape

Education

BS: Mechanical Engineering / Design Option
San Jose State University, San Jose CA

Engineering / Technology Management
Pudue University Extended Education, West Lafayette IN